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Dynachem

Vacuum Applicator 700 Series

The Dynachem Vacuum applicator is a semi-automatic microprocessor controlled machine designed to ensure complete elimination of air from printed circuit panels laminated with dry film solder mask.Complete encapsulation of the circuit traces is achieved using heat, vacuum and mechanical force.

  • Greatly reduces solder mask film waste
  • Alphanumeric display for diagnostics and sequence of operations
  • Platen temperatures individually controlled
  • State of the art vacuum technology
  • Available with 24 inches and 30 inch platens
  • Entire platen area can be filled with one or multiple panels

General Specifications

Model 724 730
Overall Dimensions
Width 1245 mm (49") 1400 mm (55.5")
Length 1803 mm (71") 2300 mm (90")
Height (min/max) 1143/1345 mm (45"/53") 1250/1346 mm (49"/53")
Working Height (min/max) 978/1080 mm (38.5"/42.5") 940/1015 mm (37"/40")
Electrical
Power Type 3 Ph, 50/60 Hz, Ground 3 Ph, 50/60 Hz, Ground
Power consumption (kVA) 6 8
Nominal Voltage 220 Vac, 380 Vac, 415 Vac, 480 Vac 220 Vac, 380 Vac, 415 Vac, 480 Vac
Phase Amperage (max) 20 A,12.0 A,10.0 A,9.0 A 23 A,13.4 A,11.5 A,10.5 A
Compressed Air
Air Consumption 25 L/min1 SCFM 25 L/min1 SCFM
Minimum Pressure 4 kg/cm2 57 psig 4 kg/cm2 57 psig
Other Specifications
Gross Weight 1015 kg (2200 LB) 1257 kg (2770 LB)
Net Weight 810 kg (1800LB) 985 kg (2171 LB)
Panel Size 610 x 610 mm (24" x 24") 765 x 765 mm (30" x 30")
Thickness (max) 3.4 mm (0.134")

Based on our experience, we believe that the above information is accurate - as it was copied from Morton International specifications for this tool. But we offer no guarantee as to the use or application of this tool or of this information.